Compared with traditional air cooling technology, liquid cooling technology has significant advantages in terms of heat dissipation efficiency and energy efficiency, and has been rapidly applied in HPC data centers in recent years. Common liquid cooling technologies include three types: immersion, spray, and cold plate.
The current liquid cooling technology still faces huge challenges. For example, although the immersion type and spray type liquid cooling have higher heat dissipation efficiency, there is no clear conclusion on whether the cooling liquid directly contacts the heating device will affect the function and life of IT components; and because More coolant is used, and the load-bearing capacity of the machine room needs to be considered, and the cost of use and maintenance is also high.
Although the water-cooled cold plate solution does not directly contact the heating device, it uses non-insulator water as the refrigerant. If a leak occurs, it will cause fatal damage to the HPC system and pose a safety hazard.
