Ultra Thin Vapor Chamber Heatsink

Ultra Thin Vapor Chamber Heatsink

Vapor chamber ( VC heatsink ) is a ultra thin completely closed flat-plate chamber composed of a bottom plate, a frame and a cover plate, and the inner wall of the chamber is provided with structure for absorbing liquid. 

The vapor chamber heatsink uses the fluid which enclosed in its own chamber to continuously evaporate and condense, so that it can quickly homogenize the temperature, so the vapor chamber can rapid heat conduction and heat diffusion.

The working principle

When the heat is transferred from the heat source to the evaporation zone, the cooling liquid in the chamber begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly, and the cooling in the gas quickly fills the entire chamber. When the gas working contact with a relatively cold area, it will condense. The heat accumulated during evaporation is released by the phenomenon of condensation, and the condensed cooling liquid will return to the evaporation heat source through the capillary channel of the microstructure, and this operation will be repeated in the chamber.

Why use vapor chamber?

With the increasing power consumption of electronic components on the market, the degree of sealed and mounted becomes more and more miniaturized. In a small space, the contradiction between the performance of electronic components and the high heat flux generated by them is becoming more and more serious. The problem is related to the reliability and lifetime of related equipment.

However, the conventional cooling method fans and heat pipes require a larger installation space due to their own volume factors, and the fans are also noisy, and the specific heat capacity of the air is relatively small. At the same time, installing multiple heat pipes will also increase the contact thermal resistance. Those factors will become barriers to the heat dissipation of electronic components.

Therefore, it is necessary to have an ultra-thin heat spreading plate suitable for heat dissipation of electronic components with high heat flux density in a narrow space. Vapor chamber is a type of flat heat pipe that can quickly transfer and diffuse the heat flow gathered on the surface of the heat source to a large condensate area, thereby promoting the dissipation of heat, reducing the heat flux density on the surface of the component, and ensuring its reliable operation.

Comparison of vapor chamber and heat pipe

The working principle of the vapor chamber is similar to heat pipe. They are all completed in a vacuum cavity and conduct heat through the evaporation and flow of liquid.

The difference is heat transfer path of the heat pipe is one-dimensional, the transfer direction is single, which mainly realizes the one-dimensional heat transfer from the heat source to the heat sink. But, the heat transfer path of the vapor chamber is two-dimensional, the heat can be conducted in multiple horizontal directions, and the heat dissipation is more efficient.

Specification:

Technique & Structure

Sealing Technique: A high temperature, high pressure, vacuum and no welding material process. During the bonding process, material grains re-arrange and make the bonding interface strength keep same as parent material.

Gravity Orientation: There is no impact about gravity orientation while the distance from heat source to vapor chamber side is within 200mm.

Post Machining: Finish goods can do CNC machining, abrasion, and brushing.

Shape: Base on stamping process to fulfill customer requirements.

Internal Supporting: Copper columns, bonded with top and bottom plate.

Wick Structure: Diffusion bonding bonded compound multi-layer mesh wick, Graded Wick Design.

Thought Hole: Through holes inside vapor chamber available, thread the through hole is available.

Pedestal: Multi-steps pedestal is available.

Capacity & Delivery time:

Capacity: 200K pcs/Month

Productivity: More than 1.5KK pcs ship out. The end users are IBM, Sapphire.

Sample Schedule: After drawing confirmed, finished in 1~2 weeks.

Production Schedule: After receiving PO, the first batch can be ship out in 1 month.

Application:

Due to low thermal resistance, good uniform temperature performance and high critical heat flux density, vapor chamber are currently widely used in many fields, such as IT product ( high end server, server, graphic card, desktop computer, note book), Telecom/Networking equipment ( high end communication and telecom equipment, switch, router ), high power LED, IGBT power system, etc.

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