Heatsink for TO263
Surface mount (Top mount) heat sink for D²PAK(To-263) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink.
Drawing of semiconductor heat sinks (to-263 heatsink)
Photos of to263 heatsink
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