Biobase Horizontal Electrophoresis Tank for PCR Test

We sincerely accept any criticism of our Vapor Chamber, Vapor Chamber Heat Sink, Heat Sink from our customers, and will continue to improve on this basis. Our company has always pursued the business philosophy of 'development by quality, navigation by science, and customer satisfaction as its purpose'. We are committed to becoming a stakeholder-satisfied company, and therefore give more prominence to technological advancement and human-centeredness.

Epoxy：

70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.

70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding

Features:

• Excellent Thermal Conductivity

• Superior Adhesion

• Low Viscosity allows quick self leveling

Typical Specifications:

Color: Grey

Viscosity, 25ºC,

Resin: 130,000

Mixed: 8,000

Specific Gravity, 25ºC: 1.81

Working time, 100 grams, 25ºC: 5 Hours

Durometer, Shore D

25ºC: 90

100ºC: 65

Tensile Strength, PSI, 25ºC: 9,000

Aluminum to Aluminum

1" overlap: 1,680

Compressive Strength, PSI, 25ºC: 18,500

Mix Ratio, by weight: 100:10

Operating temperature, ºC: -55 to 155

Coefficent of Thermal Expansion, ºC: 28 x 10-6

Thermal Conductivity, w/m ºC: 4.5

Mixing Instructions:

1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.

2) Cure according to one of the following schedules:

25ºC: 24 Hours

65ºC: 45 Minutes

125ºC: 15-20 Minutes

To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.

Epoxy bonding in liquid cold plate

Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.

  Epoxy bonding

Epoxy using in liquid cold plate process:

Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping

Our company adheres to the 'customer first, product first' business philosophy, adhere to the principle of customer first to provide customers with quality services and high cost-effective Biobase Horizontal Electrophoresis Tank for PCR Test. Customer recognition is the foundation of our development. As long as you have any requirements, we will do our best to achieve a good cooperation. We warmly welcome merchants from home and abroad to call us and establish business relationship with us, and we will do our best to serve you.