We pursue the purpose of sincerity, trustworthiness, and dedication of quality Industrial Water Cooling Cold Plate, High Quality Heat Sink, Ultra Thin Vapor Chamber Heatsink to the majority of users, and would like to be your sincere friend and ideal partner. Our company combines international quality and domestic price, and takes customer satisfaction as the starting and ending point of all work. We are constantly expanding the company's product line, constantly exporting excellent quality products, so that more customers can enjoy our first-class quality products.
Epoxy:
70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.
70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding
Features:
• Excellent Thermal Conductivity
• Superior Adhesion
• Low Viscosity allows quick self leveling
Typical Specifications:
Color: Grey
Viscosity, 25ºC,
Resin: 130,000
Mixed: 8,000
Specific Gravity, 25ºC: 1.81
Working time, 100 grams, 25ºC: 5 Hours
Durometer, Shore D
25ºC: 90
100ºC: 65
Tensile Strength, PSI, 25ºC: 9,000
Aluminum to Aluminum
1" overlap: 1,680
Compressive Strength, PSI, 25ºC: 18,500
Mix Ratio, by weight: 100:10
Operating temperature, ºC: -55 to 155
Coefficent of Thermal Expansion, ºC: 28 x 10-6
Thermal Conductivity, w/m ºC: 4.5
Mixing Instructions:
1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.
2) Cure according to one of the following schedules:
25ºC: 24 Hours
65ºC: 45 Minutes
125ºC: 15-20 Minutes
To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.
Epoxy bonding in liquid cold plate
Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.
Epoxy bonding


Epoxy using in liquid cold plate process:
Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping
As a professional manufacturer of Floor Mounted Film LED UV Dryer, our company has domestic first-class technical strength, coupled with advanced equipment and strict quality management system, which effectively guarantees product performance and quality. Innovation and seeking new requires us to always maintain a strong sense of independent innovation and pursue new development paths. With professional technology, honest management and the spirit of continuous innovation, our company has developed rapidly.
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