Artificial intelligence
Artificial intelligence brings enormous benefits to users - from generated AI code and marketing languages to customized AI applications, improving processes and simplifying operations. However, these artificial intelligence applications need to run on servers in the data center, and the server cabinets running advanced artificial intelligence applications are different from those running in traditional "production" data centers.
The racks in the production data center consume an average of 8 to 10 kilowatts of energy. Artificial intelligence and high-performance computing (HPC) cabinets can consume 50kW – 75kW or more per cabinet. This is because they require high density to provide the computing power required to run advanced artificial intelligence applications.
Due to the significant computational power required by artificial intelligence, the power consumption of the next generation of hardware will in turn generate a significant amount of heat. This heat can cause performance issues, and if not cooled within operating limits, it may lead to IT equipment hardware failures.
Data center operators must process exponentially growing datasets in a shorter period of time to meet the growing demand for electricity and thermal challenges.
When examining the infrastructure required for deploying high-performance computing for generating artificial intelligence, we found that liquid cooling systems are the primary solution to the problem of high temperatures that cannot be effectively managed by air cooling.
Liquid cooled cooling system
The liquid cooled cooling system can add higher density racks to the data center environment that you want to expand into.
The direct contact liquid cooling plate directly couples the cooling plate to high heat components, CPU, GPU, and in some cases, memory modules and power supplies.
The cold plate is located at the top of the heating component of the plate, and heat is discharged through a single-phase cold plate or two-phase fluid. These cooling technologies can remove approximately 70-75% of the heat generated by the entire equipment in the rack, and the remaining 25-30% of the heat can be easily removed through an air cooling system.
The benefits of liquid cooling, such as achieving higher efficiency, larger rack density, and improved cooling performance, make it an important method for organizations that wish to integrate cutting-edge technology and meet the cooling needs of the resulting high-density workloads.
Advanced liquid cooling device
Our microchannel liquid cooling plate provides industry-leading performance and high cooling efficiency for AI systems.
Awind channel liquid cooling has many benefits for artificial intelligence systems, including:
Low thermal resistance
High heat flux capability.
High thermal efficiency.
Customizable cooling area.
Space saving features.
Environmental sealing.
Easy to maintain and install.
Low noise level.
The Challenge of Liquid Cooling
Of course, liquid cooling also poses some challenges. The main concern is the risk of leaks or other malfunctions that may cause damage to critical hardware.
However, through careful design and implementation, these risks can be minimized and the benefits of liquid cooling can be achieved. Awind has strict requirements for the quality inspection of liquid cooled board products. We have helium leakage, water tank testing, water immersion ultrasonic testing, X-ray testing, etc. Our products undergo a series of tests before leaving the factory to ensure product quality.
In addition, we will provide you with the most cost-effective and efficient solution based on your cooling needs.
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