Liquid Water Cooling Plate Heatsink for Industrial Cooling System

Based on our traditional advantages, we actively implement the brand strategy, vigorously develop fine and efficient high-quality Aluminum Extrusion Profiles Heat Sink, Vacuum Brazing Liquid Cold Plate, Liquid Cold Plate, and promote the transformation and upgrading development of our industry. Drawing lessons from the advanced experience of today's multinational companies, formulating technology lock-in strategy to maintain our own technology advantage is one of the strategies that our company must master in transnational operation. Our company maintains a steady annual growth rate. Our products have won customers' attention with the quality unanimously praised and trusted. Honest management: the survival rule of enterprises under the condition of market economy.

Epoxy：

70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.

70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding

Features:

• Excellent Thermal Conductivity

• Superior Adhesion

• Low Viscosity allows quick self leveling

Typical Specifications:

Color: Grey

Viscosity, 25ºC,

Resin: 130,000

Mixed: 8,000

Specific Gravity, 25ºC: 1.81

Working time, 100 grams, 25ºC: 5 Hours

Durometer, Shore D

25ºC: 90

100ºC: 65

Tensile Strength, PSI, 25ºC: 9,000

Aluminum to Aluminum

1" overlap: 1,680

Compressive Strength, PSI, 25ºC: 18,500

Mix Ratio, by weight: 100:10

Operating temperature, ºC: -55 to 155

Coefficent of Thermal Expansion, ºC: 28 x 10-6

Thermal Conductivity, w/m ºC: 4.5

Mixing Instructions:

1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.

2) Cure according to one of the following schedules:

25ºC: 24 Hours

65ºC: 45 Minutes

125ºC: 15-20 Minutes

To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.

Epoxy bonding in liquid cold plate

Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.

  Epoxy bonding

Epoxy using in liquid cold plate process:

Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping

In the process of development, our company has condensed the core cultural essence of 'service and quality, management innovation and efficiency', and meticulously manufactured high-quality Liquid Water Cooling Plate Heatsink for Industrial Cooling System to contribute and repay the society in the process of continuous innovation and development. We firmly grasped the opportunity of rapid development of the macro economy, and achieved considerable results on the road of healthy, rapid and sustainable development. Our company will strengthen the production of products, and constantly improve the performance of products. We hope that through our efforts and changes, we can continuously meet the personalized needs of customers and become a good partner worthy of your trust.