We never stop improving our R&D capability, and seize every opportunity to make our Cold Forging Heat Sink for LED, OEM Folded Fin Heat Sinks, Vc Heat Sink leading in the world. The company always adheres to the business philosophy of "high requirements, high quality, and high efficiency", and strives to provide customers with high-quality and reliable products to create a win-win situation. Time has proved that our products have good application value and market efficiency. We focus on consumer concerns, provide quality products and services, and continue to create maximum value for our customers.
Epoxy:
70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.
70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding
Features:
• Excellent Thermal Conductivity
• Superior Adhesion
• Low Viscosity allows quick self leveling
Typical Specifications:
Color: Grey
Viscosity, 25ºC,
Resin: 130,000
Mixed: 8,000
Specific Gravity, 25ºC: 1.81
Working time, 100 grams, 25ºC: 5 Hours
Durometer, Shore D
25ºC: 90
100ºC: 65
Tensile Strength, PSI, 25ºC: 9,000
Aluminum to Aluminum
1" overlap: 1,680
Compressive Strength, PSI, 25ºC: 18,500
Mix Ratio, by weight: 100:10
Operating temperature, ºC: -55 to 155
Coefficent of Thermal Expansion, ºC: 28 x 10-6
Thermal Conductivity, w/m ºC: 4.5
Mixing Instructions:
1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.
2) Cure according to one of the following schedules:
25ºC: 24 Hours
65ºC: 45 Minutes
125ºC: 15-20 Minutes
To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.
Epoxy bonding in liquid cold plate
Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.
Epoxy bonding


Epoxy using in liquid cold plate process:
Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping
After years of exploration and production experience accumulation, we have updated our understanding and practical actions in Hot Sale 100 Ton Industrial Counter Flow Cooling Tower Suppliers production, research and development, independent innovation and cooperation with customers. We adhere to the hard work, advocate science, innovation and realistic style to promote the continuous development of the enterprise. We broaden the channels of using social talents and play the role of the main channel of existing talents.
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