Customized Cold Plate /Heatsink for High Power Electronic Chilling Device

Creating brand is the first concept of the company's initial establishment. Our company has been strict with every detail of production and innovated continuously from technology for many years so as to improve the quality of Industrial Water Cooling Cold Plate, Ultra Thin Vapor Chamber Heatsink, Anodized Heatsink. We formulate a perfect equity incentive plan, and set up a lean management team. Love is one of our company's core culture since we believe that only by giving love to our customers and our company can we survive and develop. We have won a good reputation and customer approval, but also in the industry to establish an excellent corporate image.

Epoxy：

70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.

70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding

Features:

• Excellent Thermal Conductivity

• Superior Adhesion

• Low Viscosity allows quick self leveling

Typical Specifications:

Color: Grey

Viscosity, 25ºC,

Resin: 130,000

Mixed: 8,000

Specific Gravity, 25ºC: 1.81

Working time, 100 grams, 25ºC: 5 Hours

Durometer, Shore D

25ºC: 90

100ºC: 65

Tensile Strength, PSI, 25ºC: 9,000

Aluminum to Aluminum

1" overlap: 1,680

Compressive Strength, PSI, 25ºC: 18,500

Mix Ratio, by weight: 100:10

Operating temperature, ºC: -55 to 155

Coefficent of Thermal Expansion, ºC: 28 x 10-6

Thermal Conductivity, w/m ºC: 4.5

Mixing Instructions:

1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.

2) Cure according to one of the following schedules:

25ºC: 24 Hours

65ºC: 45 Minutes

125ºC: 15-20 Minutes

To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.

Epoxy bonding in liquid cold plate

Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.

  Epoxy bonding

Epoxy using in liquid cold plate process:

Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping

We consider it our responsibility to maintain the superior quality of our Customized Cold Plate /Heatsink for High Power Electronic Chilling Device and reasonable prices, but never as a means of competition. In the user first, the credibility of the supremacy of purpose and dedication to the province provide customers high quality, fast, user-friendly services. We strongly advocate innovation and develop high-quality products based on innovative ideas to meet the ever-changing needs of customers.