Copper Vapor Chamber Heatsink for Industrial Cooling

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Vapor chamber

Vapor chamber ( VC heat sink ) is a completely closed flat-plate chamber composed of a bottom plate, a frame and a cover plate, and the inner wall of the chamber is provided with wick structure for absorbing liquid. The vapor chamber uses the fluid which enclosed in its own chamber to continuously evaporate and condense, so that it can quickly homogenize the temperature, so the vapor chamber can rapid heat conduction and heat diffusion.

What is Compound mesh wick structure?

The wick structure and working fluid generate the capillary forces that are required to pump liquid from the condenser to the evaporator and keep liquid evenly distributed in the wicking material. Compound mesh wick structure is an important part of vapor chamber, and makes vapor chamber can achieve rapid heat conduction and heat dissipation.

Compound mesh wick structure

Compound mesh wick structure feature:

Compound mesh wick structure is made by multi-layer copper mesh bonded.

Its structure is similar to sinter powder wick structure, but pore size uniformity is better than sinter powder wick structure.

Can be various mesh size (pore size) are compounded (by area).

Wick structure can be formed to various thickness, pore size, permeability.

Compound Multi-layer Mesh Wick has better performance than simplex sinter wick structure.

Wick structure can be divided into three parts

Condensation Part:

Absorb and hold the condensate of working fluid.

Transportation Part:

Transport liquid phase working fluid from condensation part to vaporization part.

Vaporization Part:

Vaporize working fluid and supply the back pressure of vapor flow.

Supply the backing force of liquid flow.

There are many types of Compound mesh wick structure, such as coarse pore wick, fine pore wick, sinter powder wick, etc.

Coarse pore wick is usually used as Condensation Wick and Transportation Wick in the vapor chamber, Fine Wick used as Vaporization Wick in vapor chamber.

Fine wick and Coarse Wick form Graded Wick, so that the inside of vapor chamber can be continuously circulated for evaporation and condensation.

Coarse Pore Wick

Fine Pore wick

Diffusion Bonding

Diffusion bonding is a method of creating a joint between similar or dissimilar metals, alloys, and nonmetals.

Properties of parent materials are generally unchanged.

Does not require brazing or soldering material to bond parent material.

Support column is bonded with top and bottom cover.

(1-1)	(1-2)

Donut column is bonded with top and bottom cover to be a through hole.

Pedestal Vapor Chamber

2 or 3 pedestal VC, and each pedestal is still chamber instead of solid.

Support columns are still inside the pedestal to keep VC strength.

Working Fluid Filling of vapor chamber

Degassed pure water is the working fluid and the oxygen contain is below 10 ppb.

Vacuum the chamber then fill working fluid.

Eliminate the NCG to prevent from the decay of VC.

Design Consideration

Size and Shape

Max size: 300x300 mm

Shape limitation: base on stamping ability

Thickness

3.0mm, 1.0 + 0.5 cover thickness; Qmax≦150W; Loading ≦ 60 lb; heat source ≧15x15; Dimension ≦ 100x100 mm

Through hole

Depend on location

Flatness

Copper column

Post Machining

VC Design Process

VC produce process

Awind Quality Assurance

Helium leakage test 100%

Water Quality Inspection, on line detecting.

Weight filling quantity 100%.

Thermal aging 100%.

Performance test 100%.

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