Copper Heating Tube Pipe Heatsink for Laptop

We have always adhered to the quality is the basis of survival, relying on the excellent quality of Skived Fin Heat Sink, Liquid Cooling Plate, Vacuum Brazing Liquid Cooling Heatsink, in the fierce competition in the market to ride the wave, standing invincible. We accelerate the pace of equipment upgrading and technological transformation, and continuously promote management innovation and technological innovation. Based on the tenet of truth-seeking, innovation and steady progress, all employees of our company wholeheartedly provide first-class products and services to customers to achieve a win-win situation together.

Vapor chambers (VC heat sink) offer superior thermal spreading performance over traditional solid metal heat spreaders by taking advantage of two-phase liquid/vapor transport. Their lower weight and height over traditional solutions couples with their high thermal conductivity to give extremely low thermal resistance in-plane as well as through the thickness of the vapor chamber. Vapor Chambers (VC heat sink) are best suited for components with high heat densities (larger TDP in small chip sizes) which need to spread their heat to a larger area heat exchanger to achieve safe operating temperatures, thereby providing extended life and reliability for components and applied products.

Vapor chamber features

Ø Heat spreading effect of vapor chamber is better than copper block when transferring high heat load through small distance path.

Ø Sintering Cu powder can have flexibility in different heat sink design. Wick structure have to be optimized for the different heat flux input and multi heat sources.

Ø Diffusion Bonding can get vapor chamber more reliable due to better joint.

Ø The process of tube type vapor chamber, thin vapor chamber and traditional vapor chamber can be integrated.

Traditional vapor chamber

Container: OFHC Cu

Wick type: Sintering Cu Powder

Working fluid: Pure water

Supported pillar: Cu pillar coated sintering powder

Thickness: ≥2.5mm

Base component test ------ water cooling

Test setup:

Intel Gainestown TTV

Power Input 80W @ 1.0L/min (water flow rate)

Thermal performance 50% improvement for the vapor chamber component

Heat sink Assembly Test ---- Wind Tunnel

Test setup:

Intel Gainestown TTV

Power Input 80W @ 7 CFM (air flow rate)

Thermal performance 32% improvement for heat sink assembly

Tube type vapor chamber

Container: OFHC Cu

Wick type: Sintering Cu Powder

Working fluid: Pure water

Supported pillar: Sintering powder Column

Thickness: 2.5~5.0mm

Tube type heat sink assembly test

Vapor chamber process

Reliability: Awind Reliability criteria

We adhere to the development of the main business, adhere to the basis of Copper Heating Tube Pipe Heatsink for Laptop industry, adhere to the cohesion of the company's core team. The company relies on specialization and characteristic management to become famous in the market and full of customers! We gather high-level elite management team, adhering to the complementary advantages, cooperation and win-win business policy.