Our FSW Liquid Cooling Plate, High Quality Heat Sink, Liquid Cold Plate has high scientific and technological content, superior quality and reasonable price, and has great potential for market development. The company attaches great importance to talent discovery and training, and regards human resources as the company's first resource and the company's most precious resource. Our company supplies different kinds of products with high quality and favorable price. We are glad to receive your inquiry and will reply as soon as possible. Our service concept: customer-oriented, help success, pursue excellence, and be brave in the first place.
Epoxy:
70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.
70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding
Features:
• Excellent Thermal Conductivity
• Superior Adhesion
• Low Viscosity allows quick self leveling
Typical Specifications:
Color: Grey
Viscosity, 25ºC,
Resin: 130,000
Mixed: 8,000
Specific Gravity, 25ºC: 1.81
Working time, 100 grams, 25ºC: 5 Hours
Durometer, Shore D
25ºC: 90
100ºC: 65
Tensile Strength, PSI, 25ºC: 9,000
Aluminum to Aluminum
1" overlap: 1,680
Compressive Strength, PSI, 25ºC: 18,500
Mix Ratio, by weight: 100:10
Operating temperature, ºC: -55 to 155
Coefficent of Thermal Expansion, ºC: 28 x 10-6
Thermal Conductivity, w/m ºC: 4.5
Mixing Instructions:
1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.
2) Cure according to one of the following schedules:
25ºC: 24 Hours
65ºC: 45 Minutes
125ºC: 15-20 Minutes
To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.
Epoxy bonding in liquid cold plate
Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.
Epoxy bonding


Epoxy using in liquid cold plate process:
Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping
In order to make the Cold Rolled AISI 441 Stainless Steel Sheet Plate more efficient and convenient, we constantly develop and apply new technologies to improve it. Our company will continue to adapt to the needs of reform and development, in the construction of a modern company on the road with a resounding step. First of all, we train our employees on the concept of quality service. By learning new concepts, they establish the consciousness of quality service.
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