Amplifier LED Panel Downlight CPU Passive Nvme VGA Alluminm Heatsink CPU Heatsink LED 50W for Power Supply

Our company is always developing new OEM Folded Fin Heat Sinks, Bonded Fin Heat Sinks Assemblies, Copper or Aluminum Heatsink and upgrading technology to meet the changing needs of our customers. We will continue to cooperate with all sectors of society, and sincerely hope that friends from all walks of life can continue to support and care about the development of our company. We are committed to become an excellent industrial group and work hard for the Chinese manufacturing industry to match and even surpass the world. We insist on "harmony, innovation and sustainability" as our business philosophy, and plan the future development of the company with a broader vision and longer-term gaze.

Epoxy：

70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.

70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding

Features:

• Excellent Thermal Conductivity

• Superior Adhesion

• Low Viscosity allows quick self leveling

Typical Specifications:

Color: Grey

Viscosity, 25ºC,

Resin: 130,000

Mixed: 8,000

Specific Gravity, 25ºC: 1.81

Working time, 100 grams, 25ºC: 5 Hours

Durometer, Shore D

25ºC: 90

100ºC: 65

Tensile Strength, PSI, 25ºC: 9,000

Aluminum to Aluminum

1" overlap: 1,680

Compressive Strength, PSI, 25ºC: 18,500

Mix Ratio, by weight: 100:10

Operating temperature, ºC: -55 to 155

Coefficent of Thermal Expansion, ºC: 28 x 10-6

Thermal Conductivity, w/m ºC: 4.5

Mixing Instructions:

1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.

2) Cure according to one of the following schedules:

25ºC: 24 Hours

65ºC: 45 Minutes

125ºC: 15-20 Minutes

To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.

Epoxy bonding in liquid cold plate

Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.

  Epoxy bonding

Epoxy using in liquid cold plate process:

Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping

We have been in working hard on designing, developing and manufacturing Amplifier LED Panel Downlight CPU Passive Nvme VGA Alluminm Heatsink CPU Heatsink LED 50W for Power Supply. With many years of development, our brand is recognized by all over the world and occupies great global market share. Our company starts from the actual situation, gives full play to our talent and technology advantages, and continues to optimize our operation. The company attaches great importance to the internal management and quality control of the enterprise.