In order to innovate and perfect the quality of Vacuum Brazing Liquid Cooling Heatsink, OEM Folded Fin Heat Sinks, Liquid Cold Plate, we always adhere to the consistent attitude of innovation and surpassing ourselves. We are guided by the scientific concept of development, driven by institutional innovation and technological innovation, guided by the priority development of advanced manufacturing and modern service industries, and worked hand in hand with our strategic partners in a new development cooperation model. Choose us, we will become your partner, walk with you, and become your eternal friend with high-quality products, reasonable prices and sincere service.
Epoxy:
70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.
70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding
Features:
• Excellent Thermal Conductivity
• Superior Adhesion
• Low Viscosity allows quick self leveling
Typical Specifications:
Color: Grey
Viscosity, 25ºC,
Resin: 130,000
Mixed: 8,000
Specific Gravity, 25ºC: 1.81
Working time, 100 grams, 25ºC: 5 Hours
Durometer, Shore D
25ºC: 90
100ºC: 65
Tensile Strength, PSI, 25ºC: 9,000
Aluminum to Aluminum
1" overlap: 1,680
Compressive Strength, PSI, 25ºC: 18,500
Mix Ratio, by weight: 100:10
Operating temperature, ºC: -55 to 155
Coefficent of Thermal Expansion, ºC: 28 x 10-6
Thermal Conductivity, w/m ºC: 4.5
Mixing Instructions:
1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.
2) Cure according to one of the following schedules:
25ºC: 24 Hours
65ºC: 45 Minutes
125ºC: 15-20 Minutes
To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.
Epoxy bonding in liquid cold plate
Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.
Epoxy bonding


Epoxy using in liquid cold plate process:
Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping
We believe that human resources are the most valuable resources of an enterprise, and quality Air Cooled Glycol Chiller Pharmaceutical Water Chiller for Reaction Kettle come from the hands of good employees. Brand is not something that can be easily obtained by a huge amount of advertising investment. On the premise of safety, our business orientation is to allow assets to continue to increase in value, and to handle the relationship between "scale, speed, and quality".
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