We will provide you with excellent Vacuum Brazing Liquid Cooling Heatsink, Heat Sink with Copper Heat Pipe, Anodized Heatsink and perfect pre-sales and after-sales service with all our heart. We have built advanced manufacturing capabilities of international standard, providing our customers with high standard and quality processing services. Create value for customers, create benefits for partners, and solve problems for customers.
Epoxy:
70-3812NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a unique combination of fillers, particle sizes and dispersion techniques.
70-3812NC has good heat dissipation making this a popular choice for a variety of heat sink applications. Its viscosity is particularly suited for Fin bonding
Features:
• Excellent Thermal Conductivity
• Superior Adhesion
• Low Viscosity allows quick self leveling
Typical Specifications:
Color: Grey
Viscosity, 25ºC,
Resin: 130,000
Mixed: 8,000
Specific Gravity, 25ºC: 1.81
Working time, 100 grams, 25ºC: 5 Hours
Durometer, Shore D
25ºC: 90
100ºC: 65
Tensile Strength, PSI, 25ºC: 9,000
Aluminum to Aluminum
1" overlap: 1,680
Compressive Strength, PSI, 25ºC: 18,500
Mix Ratio, by weight: 100:10
Operating temperature, ºC: -55 to 155
Coefficent of Thermal Expansion, ºC: 28 x 10-6
Thermal Conductivity, w/m ºC: 4.5
Mixing Instructions:
1) By weight thoroughly mix 100 parts 70-3812RNC epoxy with 10 parts 70-3812C.
2) Cure according to one of the following schedules:
25ºC: 24 Hours
65ºC: 45 Minutes
125ºC: 15-20 Minutes
To reduce the viscosity of the resin and help with air release, warm the resin to moderate temperatures (80-100ºF) before adding the curing agent. Some settling is common during storage and transit. Premix resin thoroughly before adding curing agent.
Epoxy bonding in liquid cold plate
Because epoxy has excellent thermal conductivity, excellent adhesion, and low viscosity allowing rapid self-leveling, we use it in copper pipe water-cooling plates.
Epoxy bonding


Epoxy using in liquid cold plate process:
Apply 70-3812 high thermal epoxy, measure the weight: after applying - before applying=0.2 +/-1g

Apply Epoxy again for better bonding result, measure by weight: after applied- before applied=1~3g fill up all cavities formed after stamping.

Auto dispenser to apply Epoxy

Fill up all cavities formed after stamping
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