High Power Heat Pipe Dense Fin Heat Sink for Power Electronics and Semiconductors

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VC Heat Sink

VC (Vapor Chambers) is also called flat heat pipe. With the continuous improvement of chip power density, VC heatsink has been widely used in the heat dissipation of CPU, NP, ASIC and other high power consumption devices.

VC heatsink is better than heat pipe or metal base heatsink

While VC heat sink can be considered flat heat pipe, it still has some core advantages. Compared with metal or heat pipe, its temperature uniformity is better. The surface temperature can be more uniform (reduced more hot spots). Second, using a VC heat sink allows direct contact between the heat source and the device, thereby reducing thermal resistance; whereas heat pipes usually need to be embedded in the base.

Comparison of VC with heat pipe and metal

Use VC heatsink to equalize the temperature instead of transferring heat like the heat pipe

Heat pipes are used for connecting heat sources to distal fins, especially for relatively tortuous paths. Even if the path is straight, more heat pipes are used instead of vapor chamber for the heat to be transferred remotely. This is the key difference between heat pipes and vapor chamber heat sink , heat pipes focus on transferring heat.

VC diffuses heat, heat pipe transfers heat

The use of heat pipes is also an option when the cost is the priority, the two heat sources are close together and the temperature is required to be uniform.

The vapor chamber area should be at least 10 times area of the heat source

Like heat pipes, the thermal conductivity of vapor chamber increases with length. This means that vapor chamber of the same size as the heat source has little advantage over a copper substrate. The area of the VC should be equal to or greater than 10 times area of the heat source.

VC should be at least 10 times the size of the heat source

Other considerations

Size - vapor chamber used for electronics cooling, rarely exceeds 300-400 mm in X and Y directions. Sintered metal core is the most common type, with VC thickness between 2.5-4.0mm.

Power Density - The ideal heat source power density of vapor chamber is more than 20 W/cm 2 , but in practice many devices exceed 300 W/cm 2 .

Protection - The coating most commonly used for heat pipes and vapor chamber is nickel plating for corrosion protection and aesthetics.

Operating Temperature - While VC heat sink can withstand multiple cycles of freeze and thaw, their optimum operating temperature range is between 1-100°C.

Pressure - VC heatsinks are typically designed to withstand 60psi of pressure prior to deformation. However, up to 90psi.

Material - The material of vc vapor chamber is copper,  some customized vapor chamber heat sink will made by aluminum.

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