Our philosophy is to serve our customers, not only to provide the high quality Anodized Heatsink, Vapor Chamber Heat Sink, Cooling Plate Heat Sinks they need, but also the attentive service they require. We adhere to people-oriented, employee interests first, investor interests second, that talent is the company's most valuable property. We believe that companies should think about the impact of their activities on society from a long-term perspective. We aim at product diversification, price rationalization and internationalization of sales.
Vapor chambers (VC heat sink) offer superior thermal spreading performance over traditional solid metal heat spreaders by taking advantage of two-phase liquid/vapor transport. Their lower weight and height over traditional solutions couples with their high thermal conductivity to give extremely low thermal resistance in-plane as well as through the thickness of the vapor chamber. Vapor Chambers (VC heat sink) are best suited for components with high heat densities (larger TDP in small chip sizes) which need to spread their heat to a larger area heat exchanger to achieve safe operating temperatures, thereby providing extended life and reliability for components and applied products.

Vapor chamber features
Ø Heat spreading effect of vapor chamber is better than copper block when transferring high heat load through small distance path.
Ø Sintering Cu powder can have flexibility in different heat sink design. Wick structure have to be optimized for the different heat flux input and multi heat sources.
Ø Diffusion Bonding can get vapor chamber more reliable due to better joint.
Ø The process of tube type vapor chamber, thin vapor chamber and traditional vapor chamber can be integrated.
Traditional vapor chamber
Container: OFHC Cu
Wick type: Sintering Cu Powder
Working fluid: Pure water
Supported pillar: Cu pillar coated sintering powder
Thickness: ≥2.5mm
Base component test ------ water cooling
Test setup:
Intel Gainestown TTV
Power Input 80W @ 1.0L/min (water flow rate)

T_case - T_base(℃) | Rcb(℃/W) | |
Cu Base | 12.20 | 0.153 |
Vapor chamber | 8.12 | 0.102 |
Thermal performance 50% improvement for the vapor chamber component
Heat sink Assembly Test ---- Wind Tunnel
Test setup:
Intel Gainestown TTV
Power Input 80W @ 7 CFM (air flow rate)

T_case - T_amb(℃) | Rcb(℃/W) | |
Cu Base Heat sink | 37.44 | 0.468 |
Vapor chamber Heat sink | 28.40 | 0.355 |
Thermal performance 32% improvement for heat sink assembly
Tube type vapor chamber
Container: OFHC Cu
Wick type: Sintering Cu Powder
Working fluid: Pure water
Supported pillar: Sintering powder Column
Thickness: 2.5~5.0mm
Tube type heat sink assembly test

Vapor chamber process


Reliability: Awind Reliability criteria
Thermal shock | Accelerated Life | |
Vapor chamber |
| 125℃ 413 hours |
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