Epoxy Bonded Power Aluminum Heat Sink

Over the years, we have always been committed to the research and development of AL Extrusion Heat Sink, CPU Heat Sink Design, Vacuum Brazing Liquid Cold Plate, continuously improving and innovating the products to meet customers' needs. The company continues to open up the market, provide practical services, uphold the customer first, and work together with customers. Our objective is to ensure that our company adapts to the changing market environment in an overall and planned way, and to seek the survival and growth. We insist on the development strategy of customer-oriented enterprise, and we will continue to adhere to the corporate philosophy of "perfection, creation of high-quality products, and service to customers".

Vapor chamber drawing:

Product photo：

Vapor chamber:

   The vapor chamber is one of the heat pipe heat sinks, which has the characteristics of fast heat conduction, uniform heat conduction, and thinness. It can be used in combination with zipper fins heat sinks or skiving fins heat sinks to achieve better heat dissipation. Vapor chambers cooling heatsink are mainly used for heat dissipation of electronic components.

The company has a group of experienced management, design and manufacturing talents in the Epoxy Bonded Power Aluminum Heat Sink industry. We know that our customers expect extremely reliable products and all-round customer service, so we will succeed in the market. The technology, management methods and experience of our company are closely combined with the specific reality, so our business strategy is relatively stable and sustainable.