Copper Liquid Cooling Vc Plate Vapor Chamber

Since establishment, our company has always adhered to the business philosophy of 'integrity and commitment'. We will continue to innovate, serve customers with integrity, and strive to become a world-class manufacturer of Aluminum Cold Plates for Battery, Liquid Cold Plate, Heat Sink with Copper Heat Pipe! With our hard work, honest management and strong main business, the scale of our enterprise has been growing. All from the customer's interests, to create value for the user is the fundamental driving force for the sustainable development of our company. A sense of teamwork and a strong sense of responsibility and mission are the inexhaustible source of our business.

Vapor chambers (VC heat sink) offer superior thermal spreading performance over traditional solid metal heat spreaders by taking advantage of two-phase liquid/vapor transport. Their lower weight and height over traditional solutions couples with their high thermal conductivity to give extremely low thermal resistance in-plane as well as through the thickness of the vapor chamber. Vapor Chambers (VC heat sink) are best suited for components with high heat densities (larger TDP in small chip sizes) which need to spread their heat to a larger area heat exchanger to achieve safe operating temperatures, thereby providing extended life and reliability for components and applied products.

Vapor chamber features

Ø Heat spreading effect of vapor chamber is better than copper block when transferring high heat load through small distance path.

Ø Sintering Cu powder can have flexibility in different heat sink design. Wick structure have to be optimized for the different heat flux input and multi heat sources.

Ø Diffusion Bonding can get vapor chamber more reliable due to better joint.

Ø The process of tube type vapor chamber, thin vapor chamber and traditional vapor chamber can be integrated.

Traditional vapor chamber

Container: OFHC Cu

Wick type: Sintering Cu Powder

Working fluid: Pure water

Supported pillar: Cu pillar coated sintering powder

Thickness: ≥2.5mm

Base component test ------ water cooling

Test setup:

Intel Gainestown TTV

Power Input 80W @ 1.0L/min (water flow rate)

Thermal performance 50% improvement for the vapor chamber component

Heat sink Assembly Test ---- Wind Tunnel

Test setup:

Intel Gainestown TTV

Power Input 80W @ 7 CFM (air flow rate)

Thermal performance 32% improvement for heat sink assembly

Tube type vapor chamber

Container: OFHC Cu

Wick type: Sintering Cu Powder

Working fluid: Pure water

Supported pillar: Sintering powder Column

Thickness: 2.5~5.0mm

Tube type heat sink assembly test

Vapor chamber process

Reliability: Awind Reliability criteria

With the guarantee of advanced equipment and production technology, we are moving towards a well-known enterprise in the Copper Liquid Cooling Vc Plate Vapor Chamber industry. The competitiveness of an enterprise comes from management and the trust of customers in the company. We are willing to cooperate sincerely with friends from all walks of life, and look forward to contributing to the industry.