Bonded Fin Heat Sink with Copper Base

Relying on our persistence, pursuit and courage to challenge ourselves forever, we will continue to bring forth the new and create better Heatsink Design, Bonded Heat Sink, Industrial Water Cooling Cold Plate to thank new and old customers for their support. The company advances with the times, the company and customers create value, and the company and employees develop together. Our tenet is customer first, service first and development in competition. With the enterprise spirit of "strict, realistic, honest and innovative" and the business philosophy of "sincere service and common development", we have won the trust of our customers. Technological innovation is the foundation of an enterprise.

Bonded Fin Heat Sinks Assemblies

Bonded fin heat sink is made by aluminum/copper base with individual fins bonded into the grooves. Bonded fin technique is a conventional high power heat sink manufacturing technique.

We developed several bonding techniques via our own technical innovations and these include highly conductive thermal epoxy bonding, brazing, and soldering so as to greatly enhance the reliability and stability of cooling and avoid any potential risk. 

The aluminum/copper bases can be extruded, die cast, or machined. Fins are either punched from coil stock or cut from thin plate stock. The fins are inserted into the base grooves and are joined by epoxying, brazing, or soldering.

Manufacturing Process

1. A base is machined or extruded out of aluminum or copper.

2. Fins are stamped out of roll stock aluminum or copper.

3. Attachment to the base is achieved with a thermal epoxy, brazing or soldering.

Features

1. Higher aspect ratio and high fin density of fins increase cooling surface area so the heat sink with high performance.

2. Lower thermal resistance for the high power device heat dissipation.

3. Aluminum fin, copper base, aluminum base can be assembled into bonded fin assemblies.

4. Fins fabricated from sheet metal or extrusion, custom designs available, the metal plate is made of fins, which can be cut to a specific size.

5. We can customize your wings according to thermal performance requirements and packaging size height restrictions. For more complex designs, we can extrude fins to specific shapes and lengths.

6. Used for high power forced convection cooling applications.

7. Bonding resin with highly thermal conductive for minimal thermal loss.

8. Dissipate more heat than the conventional heat sinks with the same footprint.

9. Reduce heat sink and overall system volume.

10. Increase the aluminum cooling surface area by two to three times than traditional heat sink.

Manufacture black anodized bonded fin heat sinks

We don't recommed it due to the high cost. Also, the black finish doesn't contribute much to the reduction of heat in forced convection. Clear, gold chromate is often applied to protect the bonded fin heat sinks from corrosion.

Bonded Fin Heat Sinks made of aluminum and copper

We have decades of experience in bonded copper fins into aluminum base. Copper fins are assembled in combination with aluminum fins to save cost and increase thermal performance in some applications.

Application

The features of bonded fin heat sinks include more fins per inch, smaller fin gap, and flexible profile height and width so that they are suitable for different sizes of application space. This kind of heat sink is small in size and light in weight, so it is an ideal choice for cooling high power equipment. Awind bonded fin heat sink wildly applied to IGBT Devices, Welding Devices, Motor Devices, High Power Semi, Lasers System, Renewable Energy, Factory Automation, Thermoelectric Modules - TECs, Un-interruptible Power Supplies, AC Welding Switches, Power Rectification Equipment, Power Rectification Equipment, Traction Control Motor Drives.

We're seeking forward in your check out for Bonded Fin Heat Sink with Copper Base. We have long been fulfilling our public commitment to contribute to the progress and development of society and the well-being of the people of the world through our business activities. We will continue to adhere to innovation without wavering and strive to enhance our comprehensive innovation and product development capabilities.